Sealing

Depending on your individual requirements we offer different search and selection functions to help you find the appropriate material. The listed products are an extract from our actual product portfolio. More products are available on request.

Do you need further information about our adhesives for electronic applications? Please get in touch with us. We are looking forward to your email to bectron.elantas.europe@remove-this.altana.remove-this-also.com.

ProductCuringcuring conditions

Temp. Range (°C)

Viscosity (Pas)

Tg (°C)

Density (g/cm³)

Description

Bectron® SA 70L1-30

Moisture cure24h @ RT (25°C/55% RH)-55°C to +200°C44 1.05one-component system, medium viscosity, self leveling, translucent
Bectron® SA 70P1-15Moisture cure24h @ RT (25°C/55% RH)-55°C to +200°Cthixotropic paste 1.03one-component system, thixotropic paste, translucent
Bectron® SA 70P1-30Moisture cure24h @ RT (25°C/55% RH)-55°C to +200°Cthixotropic paste 1.08one-component system, thixotropic paste, translucent
Bectron® SA 70P1-34Moisture cure24h @ RT (25°C/55% RH)-55°C to +200°Cthixotropic paste 1.50one-component system, thixotropic paste, white
Bectron® SA 70P9-37Moisture cure24h @ RT (25°C/55% RH)-55°C to +200°Cthixotropic paste 1.50one-component system, thixotropic paste, black
Bectron® SA 70P9-60Moisture cure24h @ RT (25°C/55% RH)-55°C to +200°Cthixotropic paste 1.25one-component system, thixotropic paste, black

Bectron® SA 70V1-36

Moisture cure24h @ RT (25°C/55% RH)-55°C to +200°C3.2 1.04one-component system, low viscous, self leveling,  translucent