Printed Electronics Days

Wednesday 21st & Thursday 22nd September 2022

Wednesday 21st September 2022

12:30 p.m. – 6:15 p.m

Beschreibung offen

Nils Arendt
Head of Marketing, Sales & Technology


Dr. Petra Severit
Chief Technology Officer

Dr. Petra Severit
Chief Technology Officer  


Heidelberger Druckmaschinen is a German industry icon and the global market leader in sheetfed offset printing presses. The print industry has a significantly changed in the past years and digitalization is a strong force for constant change in the future.  We -Heidelberg- experience this every day and leverage our innovative strength and know-how in printing processes, materials, electronics manufacturing and digital services to create high-tech applications and expand our business beyond core.

We have established Heidelberg Printed Electronics (HPE), a dedicated business unit for the industrialization of printed electronic components and sensors, at the Wiesloch-Walldorf site. With HPE we equip surfaces with sensation and offer end-to-end realization of customer-specific solutions. Here, we can rely on 170 years of printing expertise and 40 years of electronics manufacturing and a strong partner network for materials and R&D. By using a versatile high-volume production platform, we can offer a seamless scale-up from individual production campaigns to high volumes at breakthrough price levels. Key applications and use cases which will be presented are related to the Healthcare, Automotive, and Logistics Industries. Here invite new customers: Let us print your digital future together!

Dr. Michael Kröger
Managing Director
Heidelberg Printed Electronics GmbH

Session "Manufacturing Insights"

Essemtec provides dispensing and pick & place all in one machines optimal suited for printed electronics. In this presentation we show how rheology of the used medium influences the dispensing and jetting behaviour and the properties of the products. The aspect ratios of dots (ratio of height to width) can to some extent be influenced by the process parameters. Also, the precise distribution of the dot location can optimize the electrical contact and the structural strength of the joint.

Vinzenz Bissig
Customer Application Engineer
Essemtec AG             

to be confirmed

to be confirmed

Speed plays a major role in printed electronics. Accordingly, the selection of the materials used is often determined by their drying/curing properties. Alternative methods to conventional oven drying are increasingly attracting attention. What advantages do UV- or LED-curable products offer? When is a layer completely "dry"? What problems can be associated with insufficient drying/curing? This talk deals with these type of questions and gives an insight into different drying and curing methods such as the use of UV-, LED-, NIR-, circulating air or continuous dryers.

Berit Schuster
Head of R&D – PE Functional Inks

Stefan Kessler
International Sales Manager


SESSION „ Application Scenarios I “

To satisfy the growing demand for smart components with high functionality, printed electronics could be a good alternative to classical pcb-technology. Printed electronics on various substrates extend the possibilities for innovative designs, but also create new bonding challenges. This presentation gives an overview of different connection-techniques.

Wanja Gitzel
Application Engineer Printed Electronics

Printed Electronics enables new materials to be used for new applications which have not been possible before. Especially the integration of novel materials inhibiting novel properties in existing printed products yield great market potential. A well know example of novel properties is transparency of conductors, it is used in every touch screen today. The materials used in transparent conductors may vary from application depending on the demand. The technology Kundisch is using enables highly conductive conductors while maintaining an overall transparency of more than 80%. With this technology new transparent heaters, antennas and shielding applications can be realized.

Sebastian Gepp
Head of Developement Printed Electronics
Kundisch GmbH & Co KG

Heliosonic stands for a versatile technology allowing for the digital application of functional materials. The materials can be electrically or thermally conductive or quite the opposite. They cover anything from ink jet type inks to structural adhesives, fine line high aspect ratio printing to full surface coating.

In many cases, already qualified materials for analog application methods can be turned into digitally printable materials without going through another tedious qualification process. This allows for fast development cycles and cost efficient small run production. In addition, techniques unavailable by analog or other digital deposition methods are possible. The Heliosonic Team invites you to imagine “printing the unprintable” for your application with us.

Frank Walter
Head of Materials & Application Development
Heliosonic GmbH

SESSION „ IME Insights “

Printed Electronics : Technology Benefits and Challenges

  • Benefits of Printed Electronics. (Technology capability & applications)
  • T.A.O. product solution & services  
  • Key factors for success in printed electronic

Mrs. Suparat Tansangthong
Market Development Manager

Nanogate/ HTP has decades of experience in Injection Molding and Film Insert Molding. In 2019 we made a strategical decision for the future: To give our parts a function.

In my presentation I want to show our way to printed electronics excellence and how we interpret the feedback of our customers. Regarding practice examples of our latest developments I want to dive deeper into the PyzoFlex Technology, that we have introduced together with our Research Partner Joanneum Research. PyzoFlex describes screen printable inks on PVDF- basis with which we are able to print pressure sensitive sensors that have several advantages in comparison with standard capacitive sensors.

We want also to give an overview that printed electronics does not only exist of printed traces and capacitive sensor areas.

Stefan Moitzi
Managing Director
Nanogate Central and Eastern Europe GmbH

The presentation will provide an overview of Hytech’s patented technology for high pressure forming with surface mount components for in-mold electronics. The presentation will include a detailed step by step description of the process, discussion on the types of surface mount componentry suitable for the process and some of the advantages the process delivers.

Fred Himmelein   
President and CEO Forming System Ltd.


to be confirmed

Dr. Alexander Beer
Head of Business Line Electronic

Thursday 22nd September 2022

08:30 a.m. – 1:30 p.m

Dr. Alexander Beer
Head of Business Line Electronic


Thin, lightweight, flexible and robust - these are key features of printed electronics, and the basis for seamless integration into numerous products for key industries such as automotive, packaging, consumer electronics or medical technology and pharmaceuticals. In this presentation we will give an overview on products available today as well as an outlook on future applications and markets. The presentation is based on the OE-A roadmap - a joint effort of OE-A members that captures the current state of the art, identifies key challenges and provides an outlook for future product generations.

Dr. Klaus Hecker
Managing Director
OE-A (Organic and Printed Electronics Association)
A working group within VDMA


What are the challenges of the future cabine? What will the Airbus Cabin Concept look like? What are the potential use cases for Printed Electrics? What are the key requirements for cabin products?

Konstantin Brückmann
ZAL Tech Center - Airbus

SESSION „ Solar Insights “

In today’s PV industry, printing of fine Ag electrodes on the surface of Silicon solar cells is one of the crucial steps to enable high cell efficiencies and a cost-effective production. With over 95% market share, screen printing of highly filled silver pastes remains the dominant technology. However, the ever-increasing demand for higher production throughput rates and further decrease of material costs creates unique challenges and opportunities for new approaches and materials. In this talk, we take a closer look at those alternatives and discuss their potential implication.

Dr. Sebastian Tepner
Head of Team Printing Process Modeling & Rheology
Fraunhofer Institute for Solar Energy Systems (ISE)      

The geometry or cross-section of printed conductive tracks can be used to determine the real consumption of a conductive material system. In principle, the use of the cheapest paste does not always mean the most cost-effective solution. Even apparently identical pastes with similar properties, such as sheet resistance and density, can have quite different costs when the applied conductor cross-section is considered. In addition to match environmental, electrical and mechanical material requirements for a specific application, processing properties such as drying behavior and printing speed that are optimally adapted to the production conditions also contribute to a competitive product.

Adrian Lampa
Technical Sales Manager

A significant reduction of greenhouse gas emissions is one of the major challenges global society and economies have to overcome nowadays. In this regard renewable energies and especially solar energy, being a nearly inexhaustible source, play a key role. Organic photovoltaics (OPV) features several unique characteristics allowing for an deployment far beyond the classical PV application areas, like roof top installations and solar farms. However, the potential of OPV still remains largely unexploited, despite its industrial maturity.

ASCA is the global leader in the manufacturing and commercialization of OPV. Using its proprietary free-form technology, highly customizable OPV modules can transform any kind of surface into a small power plant. In this talk the state-of-the art of OPV will be reviewed, markets and recent projects will be discussed and an outlook to the future of OPV will be presented.

Dr. Tamara Nunes Domschke
Senior Scientist, R&D Group Leader Materials

SESSION „ Application Scenarios II “

In this presentation you will see some printed samples like our first printed OLED Label with a thin battery and a curved design, as for example wine bottles. We also show some printed heaters for different applications and how to adjust the ink to reach different resistances, and we introduce our new insulator for IM-E Applications solvent based.

Philipp Hölzl
Technical Sales Manager

to be confirmed

Dr. Philip Renners
Research & Development
Witte Technology

Advantages of screen printing versus other printing techniques

Conception of resistant and functional IMD/FIM panels

- First and second surface decoration

- Second surface ink layer combinations, with optimized climate & hydrolyses resistance and improved interlayer cohesion

- Non-conductive blacks and silver color shades for functional panels and displays

- Strategies to choose the most suitable layer construction in IME

- Highly resistant protective screen printing lacquers for first surface decoration

Dr. Hans-Peter Erfurt
Head of IMD/FIM-Technology
Pröll GmbH

Printed electronics has gone through huge advances during the recent years and several applications have reached mass market maturity. Yet, the technology is still young, and the biggest market impacts are predicted to lie in the future. This talk provides an overview of the most promising fields of applications and gives insight into several applications and products based on printed electronics, like BaMoS, a system for battery monitoring, Intellistok®, an automated replenishment system for logistics or printed transparent heaters.

Dr. Florian Ullrich
Head of Business Development
Innovation Lab GmbH


to be confirmed

Dr. Alexander Beer
Head of Business Line Electronic

In addition to our conference we are offering  site tours. If you are interested in an exclusive insight into our manufacture, laboratories and application departments in Hamburg please chose your tour along with your registration.

Site tours will take place on:

Wednesday, 21st September,  9 a.m. - 11 a.m.  

Thursday, 22nd September 2022, 3 p.m. – 4:30 p.m.